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Glossary of Terms

AIS Adhesive Interconnect System
AOI Automatic Optical Inspection
AOQ Average Outgoing Quality
AQL Acceptable Quality Level
ASIC Application Specific Integrated Circuit
ATE Automatic Test Equipment
AXI Automated X-Ray Inspection
BGA Ball Grid Array
BLP Bottom Leaded Packages
BTAB Bumped Tape Automated Bonding
C4 Controlled Collapse Chip Connect
C5 Controlled Collapse Chip Carrier Connection
CAD Computer Aided Design
CAM Computer Aided Manufacturing
CAR Computer Aided Repair
CBGA Ceramic Ball Grid Array
CCA Circuit Card Assembly
CCGA Ceramic Column Grid Array
CDR Convection Dominant Reflow
CFM Continuous Flow Manufacturing
CGA Column Grid Array
CIM Computer Integrated Manufacturing
C/IR Convection/Infrared
CIS Condensation Inert Soldering
COB Chip on Board
COC Certificate Of Compliance
COF Chip On Flex
CP Capability Performance
CPI Continuous Process Improvement
CSP Chip Scale Package
DCA Direct Chip Attachment
DFA Design For Assembly
DFM Design For Manufacturability
DFX Design For Excellence
DOE Design Of Experiments
DPM Defects Per Million
ECN Engineering Change Notice
ECO Engineering Change Order
EDA Electronic Design Automation
EIS Engineering Information System
EMPA Electronic Manufacturing Process Audit
EMPC Electronic Manufacturing Process Certification
EMS Electronic Manufacturing Services
ESD Electrostatic Discharge
ESS Environmental Stress Screening
FAC Forced Air Convection
FCIP Flip Chip In Package
FCC Flat Conductor Cable
FEA Finite Element Analysis
FLT Full Liquidus Temperature
FOP Fineness of Print (Stencil)
FPT Fine Pitch Technology
HAL Hot Air Leveling
HALT Highly Accredited Life Testing
HASL Hot Air Solder Leveling
IC Integrated Circuit
ICT In-Circuit Test
ILB Inner Lead Bonding
IMC Intermetallic Compound
IR Infrared
JEDEC Joint Electronic Device Engineering Council
JIT Just In Time
KGB Known Good Board
KGD Known Good Die
LCCC Leadless Ceramic Chip Carrier
LDT Liquidus Dwell Time
LFEA Lead-Free Electronic Assembly
LGA Land Grid Array
LOC Lead On Chip
LSI Large Scale Integration
MCM Multi Chip Module
MELF Metal Electrode Leadless Face
MCT Machine Capability Testing
MLB Multi-Layer Board
MLPWB Multi-Layer Printed Wiring Board
MRP Material Requirement Planning
MSD Moisture Sensitive Device
NEMA National Electronics Manufacturers Association
NEMI National Electronics Manufacturing Initiative
NPI New Product Introduction
OA Organic Acid
OE Opto Electronic
OLB Outer Lead Bonding
OMPAC Over Molded Pad Array Carrier
P/I Packaging And Interconnection
PAC Pad Array Carrier
PBGA Plastic Ball Grid Array
PCB Printed Circuit Board
PCBA Printed Circuit Board Assembly
PCGA Plastic Column Grid Array
PCMCIA Personal Computer Memory Card Intl Association
PGA Pin Grid Array
PLCC Plastic Leaded Chip Carrier
PNP Pick And Place
PTH Pin Through Hole
PWB Printed Wiring Board
PWI Process Window Index
QFP Quad Flat Pack
QTA Quick Turn Around
RA Rosin Fully Activated
RMA Rosin Mildly Activated
ROSE Resistivity of Solvent Extraction
SCRS Single Center Reflow Soldering
SIR Surface Insulation Resistance
SMA Surface Mount Assembly
SMART Surface Mount And Related Technology
SMC Surface Mount Component
SMD Surface Mount Device
SMOBC Solder Mask Over Bare Copper
SMT Surface Mount Technology
SMTA Surface Mount Technology Association
SOIC Small Outline Integrated Circuit
SOT Small Outline Transistor
SPC Statistical Process Control
SPRS Single Pass Reflow Soldering
TAB Tape Automated Bonding
TBGA Tape Ball Grid Array
Tg Glass Transistion Temperature
THT Through-Hole Technology
TQM Total Quality Management
TSOP Thin Small Outline Package
TSSOP Think Shrink Small Outline Package
UFPT Ultra Fine Pitch Technology
ULR Ultra Low Residue
WI Wetability Index
WLP Wafer Level Packaging
WSI Wafer Scale Integration
ZAF Z-Axis Adhesive Film